Jasbir Bath
Bath Technical Consultancy
64 Montalban Drive
Fremont
CA 94536
USA
Email: Jasbir_Bath@yahoo.com
Tel: (510) 792 5053
Cell: (510) 676 5629
Fax: (510) 743 4165 |
Bath Technical Consultancy
www.bathtechnicalconsultancy.com
Professional Background:
Over fifteen years experience in research, design, development and implementation in the areas of soldering, surface mount and packaging technologies. I have extensive knowledge of lead-free and tin-lead soldering technologies and have been consulted in these and other areas by various electronic companies. I have regularly attended and presented at technical meetings and conferences globally, as well as chairing multiple industry groups and initiatives.
Professional Experience:
Vitronics-Soltec, Stratham, NH, USA
Vitronics-Soltec will be re-launching its globally-popular “5 Steps to Lead-Free Soldering” seminar program with a free one-day seminar on November 20th, 2008 in Bloomington, Minnesota, USA. The new series is the ‘QS Edition’ - ‘Motivated by Quality, Focused on Solutions.’
Opening address on “Electronics Assembly Trends” and “Best Practices in Assembly Processes” presentations by Jasbir Bath.
Christopher Associates, Santa Ana, CA, USA
9/2008 to present
Consulting Engineer for Koki tin-lead and lead-free soldering materials in the Americas.
iNEMI (InterNational Electronics Manufacturing Initiative), Herndon, VA, USA
9/2008 to present
INEMI Project Management Consultant/ Project Chair, Pb-free Rework Optimization. iNEMI Payette board assembly, rework and reliability testing (125mil/ 3.2mm thick board, OSP board surface finish, Components: BGA socket, DIMM278, DIP16, uBGA, CBGA, MLF/QFN)
Flextronics International/ Solectron Corporation, San Jose, CA, USA
Lead Engineer, Technology Leadership Group 11/98 to 7/08
Research, development and qualification of tin-lead and lead-free soldering materials, processes and components. Global lead engineer for lead-free for Flextronics/ Solectron
Worked in INEMI (InterNational Electronics Manufacturing Initiative) Lead-free Task Force as Chair Lead-free Alloy, Process and Rework Groups (1999- present)
Speaker at INEMI lead-free forum presentations at IPC APEX 2001 to 2002, 2004 to 2008 conferences. Active member INEMI Component Tin Whisker Test Group.
Co-Chair of Flextronics Lead-free Working Group (Flextronics, Agilent, Cisco, HP, SUN, Amkor, NEC, Xilinx, Motorola, Amkor, EPSI) 2003-present:
Co-wrote lead-free chapter for Lead-free Electronics book [IEEE Wiley (2004) ISBN-13 978-0-471-78617-7].
Editor of two lead-free books in 2007:[Springer Publications: Lead-free Soldering ISBN 978-0-387-32466-1, 2007 (299 pages).; Co-editor IEEE Wiley: Lead-free Electronics:INEMI Projects lead to Successful Manufacturing ISBN 978-0-471-44887-7, 2007 (452 pages).].
Co-chair: IPC/JEDEC Lead-free Labeling Standard Group (J-STD-609).
Member IPC Blue Ribbon Committee for IPC ROHS Process Capability Audit (2006)
IPC APEX Conference Technical Committee (2007- present)
IEEE Manufacturing Journal Technical Paper Reviewer (2006- present)
International Tin Research Institute/SolderTec, England.
Technical Officer, Soldering Technology 5/93-9/98
Research and development of the company’s products and services.
Lead-free soldering: research and development on the properties of alternative lead-free solders, components and boards compared to existing tin-lead products.
Education/Awards:
MS Materials Science: (1992)
University of Manchester/UMIST, Manchester, England, U.K.
BS Materials Science: (1991)
University of Manchester/UMIST, Manchester, England, U.K.
IPC APEX 2007 Technical Conference Best US Paper Award Author
SMTA(Surface Mount Technology Association) Silicon Valley Chapter President: (2007- present), Vice-President of Technical Programs (2006)
Email us at: jasbir_bath@yahoo.com
Visit us at: bathtechnicalconsultancy.com |
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